1st TIARA-IEEE SYW Seminar in Taiwan

Innovation for Lightweight AI: Technology and Applications

Vision: Connecting International Tech Talents

Mission: Engaging global SYW with industry, academia and research professionals worldwide

[ Registration → ]: https://ievents.iii.org.tw/JoinPNew.aspx?t=0&id=2969

About the Seminar

The 1st TIARA-IEEE SYW Seminar in Taiwan is a landmark event focused on “Innovation for Lightweight AI: Technology and Applications“. This hybrid seminar aims to bridge global Students, Young Professionals, and Women in Engineering with leading industry, academia, and research professionals worldwide.

Co-organized by TIARA (Taiwan Industry-Academia Research Alliance), IEEE Taipei Section, and IEEE Tainan Section, this seminar strengthens partnerships, builds a vital talent platform, and enhances Taiwan’s global visibility in the critical domains of semiconductors, IC design, and AI.

Highlights of the Event

• Pioneering Event: This is the first-ever TIARA-IEEE SYW Seminar in Taiwan, emphasizing cross-sector and international talent connection. It will be held in a hybrid format, with an estimated 80 attendees onsite and 1,000 online.

• Part of IEEE Day Worldwide: This seminar is proudly connected to IEEE Day, an annual global event celebrating the historic gathering of engineers in 1884 to share technical ideas. It showcases how IEEE members collaborate to leverage technology for a better tomorrow.

• Co-located with TIE (Taiwan InnoTech EXPO): The seminar is strategically co-located with the Taiwan InnoTech EXPO 2025 (TIE), a premier one-stop exhibition for innovation resources. TIE brings together 11 government departments and councils, features over 430 participating companies and 20+ exhibitors from more than 20 countries, showcasing over 1,000 innovative technologies [As per previous conversation history]. For more information about TIE 2025, please visit: https://tie.twtm.com.tw/en.

• Engaging Leaders and Representatives: We are honored to welcome eminent leaders from IEEE Region 10 and host international and local SYW representatives for insightful short talks and panel discussions.

Target Audience

This seminar is specifically designed for:

• SYW attendees: Students, Young Professionals, Women in Engineering

• Industry, academia, and research professionals in the fields of semiconductors, IC design, and AI.

[ Registration → ]: https://ievents.iii.org.tw/JoinPNew.aspx?t=0&id=2969

Event Information

• Date: October 16, 2025 (Thursday)

• Venue: South Lounge, 3F, Taipei International Convention Center (TICC), Taiwan

• Format: Hybrid (Onsite & Online)

  • Onsite participation: 80 seats

  • Online participation: [the broadcast link will be announced in early Oct.]

Agenda (09:30~12:20)

(UTC+8 Taipei Time)

[ Registration → ]: https://ievents.iii.org.tw/JoinPNew.aspx?t=0&id=2969

Organizing Units

• Guided by: Industrial Development Agency (IDA), Ministry of Economic Affairs (MOEA)

• Co-organized by:

  • Institute for Information Industry (III) under the iCiE Program

  • Taiwan IC Industry and Academia Research Alliance (TIARA)

  • IEEE Taipei Section

  • IEEE Tainan Section

• In collaboration with:

  • National Yang Ming Chao Tung University (NYCU)

  • National Cheng Kung University (NCKU)

  • National University of Kaohsiung (NUK)

Organizing Committee

• Advisory Board:

  Prof./Dr. Shih-Chien Chang
  Prof./Dr. Shawn Shuo-Hung Hsu
  Prof./Dr. Li-Chun Wang
  Prof./Dr. Pei-Yin Chen

• General Chair & Co-Chairs:

  Prof./Dr. Chris Gwo-Giun Lee
  Prof./Dr. Pei-Wen Li
  Prof./Dr. Meng-Hsueh Chiang
  Prof./Dr. Chuen Yau Chen

• Executive Chair:

  Dr. Jeng-Long Chiang

• Program Co-Chairs:

  Prof./Dr. Yu-Te Liao
  Prof./Dr. Kun-Chih Chen

• WIE Chair:

  Prof./Dr. Wei-Chen Tu

• Secretariat:

  Grace Wang
  Summer Lee
  Renie Hung

Contact Us

• TIARA:

  • Email: tiaratwic@gamil.com

  • Phone: +886-35912777

• IEEE Taipei Section:

  • Email: ie3taipeisection@gmail.com

  • Phone: +886-35712121 ext.54484 / 31590

• IEEE Tainan Section:

  • Email: tainansection.ieee@gmail.com

  • Phone: +886-62757575 ext.62552